Geological Sciences
Experience our wide range of versatile systems for trimming, lapping,
Semiconductors
Utilize our team of experts to integrate relevant Logitech processes and systems into your thin or ultra-thin wafer fabrication
CMP Applications
Apply Logitech’s highly versatile chemical mechanical polishing systems to your surface quality applications for high geometric precision and flatness.
Optoelectronics
Introduce an adaptable range of Logitech optoelectronic material processing systems to your processes for precise tolerances with defect-free surfaces.
Optics
Ensure you achieve the highest results possible with Logitech’s adaptable cutting lapping and polishing systems for optics processes.
Other Applications
There are many applications where Logitech systems provide real solutions to complex material preparation problems. Processed materials include calcified tissues, bone sections, ceramics, bark and more.
Achieve methods for thinning down silicon wafers to a final thickness as low as 2 μm with Logitech systems such as the PM6- Precision Lapping & Polishing System.
Silicon Carbide
Utilize Logitech’s automated precision lapping and polishing system, Akribis Air, to ensure accuracy,
Sapphire
Reduce the final thickness of sapphire wafers with a TTV of better than +/- 2 microns and an improved surface roughness of less than 2nm with Logitech systems such as the PM6- Precision Lapping & Polishing System.
Gallium Arsenide
This versatile semiconductor can be processed to a flatness of 5 fringes and surface finish of Ra 3-4nm with Logitech systems such as the PM6- Precision Lapping and Polishing System or Akribis Air.
Cadmium Zinc Telluride
Process this direct bandgap semiconductor for a variety of applications, such as electro-optic modulators, solar cells and more.
Indium Phosphide
Used in high power and high-frequency electronics, InP boasts a superior electron velocity in comparison to more common semiconductors. Utilize Logitech to ensure
Rock/Soil
Investigate thin section samples with the production of geological thin sections from Logitech. We provide machine systems incorporating vacuum impregnation, cutting, lapping and polishing equipment to ensure optimum results.
Other Materials
There are many other materials Logitech has had significant experience in providing processing solutions for. They include: polymers, ceramics, cadmium sulfide, diamond, lithium niobate and more.