Processing Fused Wafers

Learn Logitech process routes for thinning down the top wafer of a two wafer fusion bonded assembly. 

With over 50 years experience in the production of lapping & polishing systems for wafer processing, Logitech has responded to the need for successful methods of fused wafer thinning.

Learn the process:

Download the application note on "Fused Wafers" to learn the process routes and methodologies to achieve a final thickness as low as 10μm.

You'll also benefit from insight on:

  • Temporary bonding that minimises risk of breakage whilst maintaining sample yield
  • Intelligent features for automated processing operations with minimal user input
  • Two-in-one systems for first phase thinning and subsequent polishing 

Embrace the cutting edge – you’re in safe hands.